As a connection point between the upstream and downstream industries, LED packaging plays a key role in linking up and down. With the development of LEDs with high efficiency, power, high reliability and low cost, the requirements for packaging have increased.
As a result, the packaging industry has been in the fast driving and development stage of new materials and new processes in recent years. Emerging packaging forms and technologies are emerging one after another, such as EMC, COB, flip-chip, CSP… Who will become the king?
Emerging packaging forms
Business photo darling – COB
COB technology has the advantages of soft light, simple circuit design, high cost efficiency, saving system space, significant heat dissipation, high package and output density. Although it still has the technical problems of chip integration brightness, color temperature adjustment and system integration, the light quality improvement effect brought by it is unmatched by the single high-power device on the market, and has considerable development in the LED light source market for illumination. potential.
As a result, global LED packaging companies are constantly upgrading their COB packaging technology to continuously optimize the product life, reliability and critical luminous efficiency of COB light sources. MCOB, AC-COB, flip-chip COB and other emerging COB technologies known as “high quality, high efficiency, and high cost performance” have emerged.
COB-packaged bulbs already account for about 40% of LED bulbs. Its clear advantages in the field of commercial lighting make it the current mainstream solution for directional lighting, and it will become the mainstay of the packaging field in the future.
The king of cost performance – EMC
EMC is actually a change in packaging materials. It has the characteristics of high heat resistance, UV resistance, high integration, high current, small size and high stability. It is used in the field of bulbs with strict heat dissipation requirements, outdoor lamps with high requirements against VU, and high stability. The backlight field has outstanding advantages.
Since the introduction and use of LED in the field of LED packaging in 2014, EMC has been greatly developed in indoor lighting, and has quickly become a mainstream product that competes with SMD and COB.
It is understood that EMC currently has several models such as 3030, 5050, 7070, etc., of which 3030 cost performance has been quite prominent, and the light efficiency is almost the same as COB. The 5050 and 7070 can replace 3-7W and 7-15W COB products respectively, and the cost of the light source can be saved by more than 30%.
Then there is an upgraded version of EMC – SMC, which is made of silicone material, has a higher heat resistance and UV resistance than EMC’s epoxy material, and may be applied to flip chip in the future. Although the cost is increased, the power is increased accordingly, and the manufacturing process can be extended to the original EMC packaging process.
At present, street lamp manufacturers have been introducing EMC and SMC packaging products one after another, and will have a place in the application of small and medium power in the future.
High power advantage – flip chip
Flip chip has the advantages of small size, enhanced performance, high reliability, and fast heat dissipation. However, due to cost and other reasons, the downstream terminal market has remained quiet. In recent years, technological breakthroughs have made it more widely used. The market share has increased rapidly.
Most packaging companies have taken this packaging technology as the focus of research and development and innovation.
At present, flip-chip LED technology has great advantages in high-power products and integrated packaging, but in the application of small and medium-sized power, the cost competitiveness is not strong, and the cost of the front-end equipment brought by process subversion needs to be digested for a while.
Backlight market speedup – CSP
There is nothing wrong with it. CSP is the most topical package in the packaging industry. It has low light efficiency, difficult soldering, uniform color and cost, but high light-emitting surface, high optical density, uniform color and small size. Sexuality and cost reduction have great potential for space, especially in LED bulbs and LED tubes, which have excellent design flexibility and become the blue ocean market that all major companies are competing for.
At this stage, CSP’s market share in the field of LED backlighting and mobile phone flash is increasing, but few companies in the field of lighting can achieve mass production.
Because under the premise of the same light effect, CSP is not obvious for the mature medium-power SMD, whether it is light efficiency or cost performance. And most of the current CSP is based on flip chip development, and the yield and light efficiency of flip chip has not yet reached the effect of the packaged chip. At the same time, there are not enough enterprises producing CSP, the scale effect is not obvious, and the cost has not been reduced to the scope of popularization.
High color consistency – RP
(Remote fluorescent packaging technology) The relative performance of RP packaging technology is more prominent:
First, the phosphor powder is far away from the LED chip, the phosphor is not easily affected by the heat of the PN junction, and the life of the light source is prolonged; secondly, the structure of the phosphor away from the chip design facilitates the extraction of light and improves the luminous efficiency of the light source. Third, the light color space is evenly distributed and the color consistency is high.
In recent years, UV-excited remote packaging technology has attracted people’s attention. Compared with traditional UV light sources, it has unique advantages, including low power consumption, fast luminescence response, high reliability, high radiation efficiency, long life and no pollution to the environment. , compact structure and many other advantages.
However, at present, the relative progress is slow, and there are not many companies investing in R&D.
Highly integrated – AC LED
This year, SMD+IC and AC-COB have become the main products of major packaging companies, especially for domestic packaging companies. It seems that “the packaging company no longer pushes the package, but instead ‘cross-border’ to do the AC module and do the integrated light source”.
AC LED can reduce the driving cost of the lamp by 20%-30%, effectively avoiding the damage of the LED lamp caused by the driving power supply, and conforming to the development trend of simplification and high integration, but the problems of poor heat dissipation, low stability, stroboscopic and the like cause it to be delayed. Delayed in real marketization.
In the past two years, AC LED technology has made breakthroughs, especially Seoul Semiconductor has spared no effort in this field. Its products have been able to improve the optical stroboscopic problem of AC LED itself, and can realize intelligent lighting function.
Various package forms cross each other
It is precisely because of the various schools of contention that there is a contending for a healthy competition in the benign competition of the packaging industry. Diversification of packaging technology is the result of technological innovation and is also created to adapt to the different application needs of different fields or locations of LED.
Each package has its specific application advantages and a targeted market. It cannot be overwhelmed which package form will become mainstream. Each package will occupy a part of the market for a long time.